About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Presentation Title |
Multi-Material Inkjet Print Deposition of Particle-Free Silver and Molecular-Organic-Decomposition Nickel Inks for High Temperature Conductive Circuit Thermal Shielding |
Author(s) |
Sean Jackson |
On-Site Speaker (Planned) |
Sean Jackson |
Abstract Scope |
This study investigates the inkjet print manufacturing of particle free silver (Ag) circuits as thermally shielded by inkjet printed, particle free nickel molecular organic decomposition (NiMOD) inks on high temperature ceramic and silicon carbide substrates. The inkjet printed Ag-Ni composite is subject to high temperature (600-1200 oC) torch testing, coupled with two-point resistive probe testing, for in situ thermo-electrical characterization of thermally stressed Ag circuitry. Two-probe electrical testing identified proportionality between Ni shield thickness, thermal protection limit, and Ag circuit thermal protection duration at elevated temperatures (9.75 Ohm/☐ at minimum). Characterization of macrostructure-resistance relationships demonstrates potential for targeted thermal shielding of printed circuits via AM-driven nickel plating. The conclusions drawn in this report address a need for thermal stability enhancement of conductive circuits for deployable devices in high temperature applications. |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |