About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Long-Term Thermal Reliability and Microstructural Evolution of Near-Eutectic Sn-Bi-Ag-Sb/Cu Solder Joints |
| Author(s) |
Yu-Chen Liu, Yun-Hsin Cheng |
| On-Site Speaker (Planned) |
Yu-Chen Liu |
| Abstract Scope |
This study investigates the long-term reliability and microstructural evolution of near-eutectic Sn-Bi-Ag-Sb solder/Cu solder joints for advanced packaging applications. The optimal quaternary composition was calculated using a machine learning model. Solder joints were subjected to extreme thermal aging at 125°C for up to 1008 hours. Results demonstrate that the Sn-Bi-Ag-Sb solder/Cu joint retains an exceptional shear strength of 54.6 ± 3.7 MPa, whereas the binary Sn-58Bi/Cu joint deteriorates dramatically to 28.9 ± 2.8 MPa. This remarkable reliability stems from synergistic bulk and interfacial stabilization. Specifically, Ag and Sb additions severely inhibit massive (Bi) phase coarsening via grain refinement and grain boundary pinning by fine Ag3Sn precipitates. Furthermore, interfacial Cu₆Sn₅ growth transitions to a slower volume diffusion-controlled mechanism. This machine-learning-derived alloy presents a robust low-temperature soldering solution. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Electronic Materials, Machine Learning, Phase Transformations |