About this Abstract |
| Meeting |
MS&T25: Materials Science & Technology
|
| Symposium
|
Advances in Titanium Technology
|
| Presentation Title |
Microstructure and Residual Stress at Diffusion Bonded Interface between Vanadium and Ti-6Al-4V |
| Author(s) |
Claire Leeanne Adams, Bernard Gaskey, John Carpenter, David P. Field |
| On-Site Speaker (Planned) |
Claire Leeanne Adams |
| Abstract Scope |
Dissimilar metal joining is increasingly important for a variety of technological applications. The advanced manufacturing methods that enable efficient production of multi-material parts often leave complex residual stress states that lead to geometric distortion or part failure. The microstructure and residual stresses around an interface between V and Ti-6Al-4V alloy, formed by vacuum diffusion bonding, are explored though EBSD cross correlation analysis using ATEX software, and nanoindentation. We determine that both methods provide valuable insight, but the complex microstructure and compositional gradients around the interface complicate the quantitative analysis of the nanoindentation data. |