About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Materials Deposition by Cold Spray and Related Technologies III
|
| Presentation Title |
Solid-state bulk stable nanocrystalline alloy design: inverse Hall-Petch effect promotes plasticity and consolidation of nanocrystalline microparticles |
| Author(s) |
Moses Awenbiik Adaan-Nyiak, Ahmed A. Tiamiyu |
| On-Site Speaker (Planned) |
Moses Awenbiik Adaan-Nyiak |
| Abstract Scope |
The superior strength-to-weight ratio of nanocrystalline (NC) materials makes them suitable for lightweighting, if they can be stabilized. While thermodynamic-stabilization of NC-microparticles improves their thermal-stability, conventional high-temperature consolidation methods often lead to nanograin-coarsening. Cold spray (CS), a solid-state-consolidation process, offers a suitable alternative for consolidating NC-microparticles. However, NC-microparticles’ perceived high-hardness makes flattening/consolidation difficult. Here, we propose a novel staggered-approach for developing bulk-grain boundary (GB)-decorated NC-materials that conventionally would follow a sequence: mechanical-alloying, heat-treatment, and pressure/pressureless-consolidation process. A model (AlCoCrFe)100-xZrx high-entropy alloy (HEA) is first developed via mechanical alloying, followed by CS-consolidation, and post-deposition annealing to drive the solute to GBs. Using advanced characterization techniques, we found that NC-HEA-microparticles exhibit excellent flattening that aids metallurgical bonding. The governing mechanism for GB segregation, particle-substrate segregation/bonding mechanism, and particle-flattening, governed by GB-mediated deformation mechanism characteristic of inverse Hall-Petch effect, will be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Entropy Alloys, Nanotechnology, |