About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Surface Engineering VIII
|
| Presentation Title |
Defect Evolution and Strength-Ductility Enhancement via Electrodeposition Following Sub-Recrystallization Annealing in Nickel |
| Author(s) |
Jahangir Khan Lodhi, Yuxin Hu, Benjamin W Spencer, Peter Hosemann, Fei Teng |
| On-Site Speaker (Planned) |
Jahangir Khan Lodhi |
| Abstract Scope |
Electrodeposited nickel coatings offer broad utility in surface engineering applications, yet their performance is often limited by high defect densities and entrapped hydrogen introduced during deposition. In this study, we investigate the effect of low temperature annealing (200 °C) on the microstructural evolution of these coatings. Advanced electron microscopy reveals the redistribution of crystalline defects, including dislocations and growth twins, as well as morphological changes in nanoscale bubbles like features suggestive of entrapped hydrogen. To assess the implication of these changes on the mechanical properties, we employ a mesoscale tensile testing approach specifically adapted for coatings. The results indicate that controlled thermal exposure can promote defects reconfiguration, without microstructural recrystallization, leading to enhanced mechanical properties. These findings highlight an unconventional, thermally assisted pathway for defect engineering in electrodeposited metals and suggest that entrapped hydrogen, which often viewed as detrimental, under certain conditions, may assist in enabling beneficial structural rearrangement. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Surface Modification and Coatings, Surface Modification and Coatings |