| Abstract Scope |
With the rise of AI and high-performance computing, thermal management in advanced packaging becomes critical. In TSMC’s CoWoS architecture, increased heat flux demands high-performance thermal interface materials (TIMs). This project develops a mechanically compliant, low-temperature-processable indium-based TIM foil with high thermal conductivity. A bimodal particle size distribution is designed by blending high- and low-melting-point metal powders. Indium alloy powders are prepared via shear emulsification, followed by roll forming and surface treatment. The effects of particle size, paste ratio, coating thickness, and bonding conditions on TIM structure, thermal conductivity, and reliability are analyzed using SEM, 3D X-ray, and LFA. This study aims to establish structure–property relationships, ultimately achieving a TIM with >150 W/m·K thermal conductivity, <150 °C processing temperature, and long-term stability for high-power device applications. |