About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Position-Dependent Cracking Behavior of Micro-Solder Joints on AlN Ceramic Substrates under Thermal Cycling |
| Author(s) |
Shuye Zhang, Jinhong Liu, Peng He |
| On-Site Speaker (Planned) |
Jinhong Liu |
| Abstract Scope |
AlN ceramic substrates are highly promising for advanced electronic packaging due to their excellent thermal conductivity and mechanical reliability. This study examined the thermal cycling reliability of SAC305 solder joints on AlN substrates. After 1000 cycles, distinct cracking behaviors dependent on position were observed. Outer-row joints showed cracks at both upper ((Pt, Au)-Sn IMC/solder) and lower ((Cu, Ni, Au)6Sn5 IMC/solder) interfaces, while second-row joints cracked only at the upper interface. Crack growth in outer-row joints exceeded half the joint size, whereas in second-row joints, it was limited to about a third. Cs-corrected STEM identified mixed AuSn2/PtSn2 phases at the upper interface and preferred Ni occupation at Cu2 sites within Cu6Sn5 lattices. Finite element analysis revealed about 62% higher stress concentrations in outer-row joints, causing more extensive crack propagation. Within a single solder joint, the upper interface experienced roughly 48% higher stress levels than the lower, leading to earlier crack initiation. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Joining, Modeling and Simulation, Thin Films and Interfaces |