About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Late News Poster Session
|
| Presentation Title |
C-30: Thermal Degradation Mechanisms of Nanometric Metallic Multilayers |
| Author(s) |
Abdelhafid Akarou, Florence Baras, Olivier Politano |
| On-Site Speaker (Planned) |
Abdelhafid Akarou |
| Abstract Scope |
Nanometric metallic multilayers (NMMs) have emerged as a particularly promising class of thin films for advanced technological applications. In particular, Cu–Mo NMMs can serve as thermal dissipators due to their combination of high thermal conductivity and low thermal expansion. However, a major concern remains their stability at high temperatures.
In this study, Cu–Mo nano-multilayers were investigated using molecular dynamics (MD) simulations. The stability of the incoherent Cu/Mo interface was assessed by analyzing the system’s preferred orientation relationships, specifically the Nishiyama–Wassermann (NW) and Kurdjumov–Sachs (KS) configurations.
At high temperatures, these multilayers undergo degradation due to interfacial stresses and grain boundary diffusion, which significantly impacts their thermal performance. These phenomena were investigated by annealing a polycrystalline system with columnar grains at high temperature. Diffusion mechanisms, grain boundary grooving, and microstructure evolution were characterized.
Acknowledgments:
This work is supported by ANR (grant ANR-23-CE09-0002-01). |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Modeling and Simulation, Thin Films and Interfaces, Composites |