About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Refractory Metals 2020
|
| Presentation Title |
Modifying Grain Boundary Cohesion in Ultra-fine Grained Tungsten and Tungsten-based Nanocomposites through Systematic Doping |
| Author(s) |
Michael Wurmshuber, Simon Doppermann, Stefan Wurster, Reinhard Pippan, Daniel Kiener |
| On-Site Speaker (Planned) |
Michael Wurmshuber |
| Abstract Scope |
The inherent brittleness and low ductility of tungsten often impedes its applicability in high-performance installations. A promising approach to improve mechanical strength is refining the microstructure to the ultra-fine grained regime. However, the large amount of interfaces within such materials promotes intergranular crack paths with comparably low crack growth resistance, hindering a severe improvement in toughness and ductility. Therefore, strengthening grain boundary cohesion by doping with certain elements is expected to enhance the performance. In this work, a powdermetallurgical fabrication route in conjunction with severe plastic deformation was applied to produce ultra-fine grained W, commercially pure as well as doped with potentially interface-strengthening elements. Additionally, nanocrystalline W-Cu composites with tailored interface chemistry were fabricated, adding a ductile phase for increased plasticity. Mechanical properties of all materials were thoroughly characterized applying small-scale testing techniques and the effectiveness of grain boundary chemistry tuning on the ductility of tungsten based materials is discussed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |