About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
High temperature Lead-free solder alloy: Microalloying in microstructure evolution and mechanical behavior |
| Author(s) |
Lijia Xie, Sean Lai, Jia-Huei Tien, Ching-Chien Chen, Ganesh Subbarayan, David F Bahr, Michael S Titus, John E Blendell, Carol A Handwerker |
| On-Site Speaker (Planned) |
Lijia Xie |
| Abstract Scope |
Solder alloys provide good mechanical and electronic connections for circuit boards. In recent decades, researchers have been turning their attention to lead-free solder alloys for advanced packaging applications. In this talk, the high-temperature solder (HTS) alloys refer to Sn-Ag-Cu (SAC) alloys, for example, SAC305 (Sn-3wt%Ag-0.5wt%Cu) and Innolot (Sn-3.8wt%Ag-0.7wt%Cu-3wt%Bi-1.4wt%Sb-0.15wt%Ni). Understanding the effects of alloying elements on microstructure evolution and mechanical behavior is important in alloy design and reliability analysis for solder systems.
In this talk, we examined intermetallic compounds (IMCs) and IMC layer behavior after different isothermal aging conditions, and monotonic shear tests and crack propagation analyses were also reported. Based on those results, we aim to better understand the microalloying effect and the microstructure change related to mechanical and thermal behavior. Also, understand the fracture mechanism related to microstructure evolution and test condition change. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, Electronic Materials |