About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Characterization of Electronic Device Dielectric Packaging Breakdown Phenomena |
| Author(s) |
Timothy W. Koeth, Noah Hoppis |
| On-Site Speaker (Planned) |
Timothy W. Koeth |
| Abstract Scope |
Dielectric components of spacecraft and satellites frequently undergo bulk charging by electrons and other particles from intense geomagnetic storms. Device packaging, interconnect dielectrics, epoxies, as well as many structural insulating materials are susceptible to deep charge embedding, which ultimately lead to a violent electrical and mechanical failure. Several novel techniques have been used to characterize these extreme electro-chemical degradation events in polymeric insulators irradiated by a high energy electron linear accelerator. Solid and gaseous breakdown products have been characterized in addition to electrical breakdown current, and insulation charge retention time as a function of environmental conditions. Direct imaging has also been employed to quantify breakdown velocity evolution, identifying distinct breakdown modes. Finally, by a novel non-destructive technique, a predictive model of breakdown location has been developed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Polymers, Characterization |