About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Electrostatic Assembly of Silver Micro/Nano Hybrids for Low Temperature Die Attach Sintering below 200 °C |
| Author(s) |
Jin Goo Kim, Ho Youn Yoo, Min-Su Kim |
| On-Site Speaker (Planned) |
Jin Goo Kim |
| Abstract Scope |
Ag sinter paste is a promising die attach material for power electronic packaging. However, achieving high bonding strength at low sintering temperatures remains a major challenge. In this study, a surface functionalization strategy was developed to introduce opposite charges onto Ag microflakes (MFs) and Ag nanoparticles (NPs), enabling spontaneous electrostatic assembly into Ag micro/nano (MN) hybrid structures. The assembled MN structure promotes uniform nanoparticle distribution on the microflake surface, resulting in dense particle packing and enhanced neck formation during low temperature sintering. Consequently, the MN-10 paste (10 wt.% NPs relative to MFs) achieved the highest bonding performance over 50 MPa at the sintering temperature of 200 °C. These results demonstrate that electrostatic assembly via surface functionalization is an effective strategy for low temperature Ag sintering, enabling highly dense joints with improved mechanical reliability and offering strong potential for next-generation power electronic packaging. |
| Proceedings Inclusion? |
Planned: |