About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
X-ray Laminography for Defect Characterization in 3D Heterogeneous Integrated Packages |
| Author(s) |
Sidhaant Vasudeva, Nikhilesh Chawla, Kwon-Teen Max Chen, Viktor Nikitin, Francesco De Carlo |
| On-Site Speaker (Planned) |
Sidhaant Vasudeva |
| Abstract Scope |
The growing complexity of 3D Heterogeneous Integrated packages demands rapid, accurate, and non-destructive characterization tools to identify defects and quantify reliability. However, the planar geometry of chip packages poses a challenge for conventional tomography, necessitating the development of the laminography technique.
In this study, we employed laminography at the Advanced Photon Source (APS), Argonne National Laboratory, to rapidly image and identify defects. We systematically varied the tilt angle, photon energy, and sample distance to optimize image quality and defect resolvability in interconnects. These workflows were further translated to a custom-built lab-scale laminography setup, to optimize it at this scale and make it accessible beyond synchrotron facilities. Reconstruction pipelines were developed to make data processing more efficient, with quantification of voids and secondary phases in interconnects, such as solders. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Electronic Materials, Characterization, |