About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
FE-based evaluation of moisture-induced delamination risks in semiconductor package |
| Author(s) |
Sooyeol Lee, Arka Sengupta, Satish Radhakrishnan, Woopoung Kim |
| On-Site Speaker (Planned) |
Sooyeol Lee |
| Abstract Scope |
In electronic package community, moisture-induced structural failures have been reported, and their cause and effects have been studied. Organic materials absorb moisture during storage and/or preconditioning, weakening interfacial adhesion. During high temperature reflow, vapor pressure can drastically increase, potentially causing delamination. This paper specifically presents the case where moisture impacts PID and RDL layers in an AI advanced package to cause structural failure and the way that the effects of each individual absorption and desorption step, along with moisture-related impacts, are scrutinized. For these purposes, with original PID and RDL models from ECAD, moisture behavior along manufacturing and experimental steps has been analyzed in FEA. Investigation of vapor pressure shows that as temperature goes up to reflow temperature, the vapor pressure may severely increase, threatening the structural soundness. The results show good correlation with experimental data, along with proposed solutions to mitigate such risks. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Mechanical Properties, Thin Films and Interfaces |