About this Abstract |
| Meeting |
MS&T25: Materials Science & Technology
|
| Symposium
|
Engineering Ceramics: Microstructure-Property-Performance Relations and Applications
|
| Presentation Title |
Fatigue Behavior of Grain Boundaries in High Thermal Conductivity Silicon Nitride Ceramics Evaluated by Microcantilever Bending Test |
| Author(s) |
Junichi Tatami, Komaki Matsuura, Motoyuki Iijima, Takuma Takahashi, Tatsuki Ohji, Hiromi Nakano |
| On-Site Speaker (Planned) |
Junichi Tatami |
| Abstract Scope |
In this study, we aimed to clarify the fatigue behavior of grain boundaries in high thermal conductivity silicon nitride ceramics by microcantilever bending tests. First, a spherical indenter was repeatedly pressed into a mirror-polished surface to simulate the stress state in a copper-plated substrate. The strength of the grain boundary on the surface was measured by a microcantilever bending test. The results showed that the grain boundary strength decreased with repeated application of stress. The grain boundary strength decreased with repeated stress application to the microcantilever specimen, which was prepared with the grain boundary at the root, suggesting that the accumulation of such dislocations near the surface was the source of stress concentration that reduced the grain boundary strength. The TEM observation showed many dislocations in the near-surface region. |