About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
Presentation Title |
Rapid and Non-Contact Density Measurement for Powder-Based AM Via Flash Thermography |
Author(s) |
Shu Wang, Dylan Conover, Nathan Crane |
On-Site Speaker (Planned) |
Shu Wang |
Abstract Scope |
We present a physics-based framework for extracting thermal diffusivity and powder bed density from flash thermography for powder-based additive manufacturing processes. The method resolves material properties with <1% standard deviation using a 1D heat transfer model, despite significant 3D effects and unknown interfacial conditions. The method enables accurate, non-contact diagnostics across dry and cured powder systems with varying thermal contact and saturation levels. This method eliminates the need for known substrate conductivity or assumed thermal gradients. Extensive experiments based on this method reveal a strong correlation between thermal diffusivity and binder saturation, suggesting its potential for characterizing internal structural evolution. It also offers potential for non-destructive evaluation of interfacial bonding through thermal contact resistance. This mechanism-driven framework supports robust, rapid, and transferable density measurements under practical boundary and environmental variability, offering value for process monitoring in binder jetting, powder bed fusion, and related technologies. |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |