| Abstract Scope |
Advanced materials increasingly require measurement methods capable of capturing their heterogeneous, anisotropic, and process-dependent behavior. Conventional sensors provide accurate measurements at discrete locations. Recent advances in multispectral sensing, GPU computation, and artificial intelligence now enable the holistic material response to be measured and analyzed in real time.
This paper describes a multispectral optical measurement framework that combines 3D-DIC, photogrammetry and infrared thermography. The resulting synchronized data describe full-field surface geometry, displacement, strain, temperature, thermal response, and process evolution. GPU-based processing converts the image streams into spatially registered engineering data. These measurements can be used to determine local and global material properties.
Multithreaded artificial-intelligence analysis can further identify characteristic material and process signatures and classify emerging anomalies. During manufacturing, the same architecture can support closed-loop machine control and in-situ nondestructive evaluation. This creates a direct connection among material testing, process monitoring, simulation validation, manufacturing control, and the digital thread. |