About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Microstructure-Sensitive Modeling Across Length Scales: An MPMD/SMD Symposium in Honor of David L. McDowell
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| Presentation Title |
Strain Localization in Fatigue of FCC and HCP Materials |
| Author(s) |
Jean Charles Stinville, Benham Ahmadikia, Irene Beyerlein, Tresa M. Pollock |
| On-Site Speaker (Planned) |
Tresa M. Pollock |
| Abstract Scope |
Recent advances in accelerated fatigue testing, in-situ electron microscopy, digital image correlation have been integrated to quantitatively analyze slip events and their reversibility during fatigue. Quantitative relations between the yield and ultimate tensile strength, fatigue strength and the physical characteristics of early slip localization events are identified for a large set of FCC and HCP materials. The fatigue strength in the VHCF regime can be predicted by the amplitude of localization during the first cycle of loading. Additionally, the intensity of slip and spacings between localization events are strongly related to material yield strength. Using a three-dimensional crystal plasticity-based micromechanical model that explicitly simulates the growth of discrete slip localizations, it is shown that the stronger the metal, the faster and earlier that slip localizations intensify. The relationship is attributed to the formation of a zone that surrounds the slip localization where the driving force for slip is absent. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, High-Temperature Materials, Mechanical Properties |