About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Materials Aging and Compatibility: Experimental and Computational Approaches to Enable Lifetime Predictions
|
| Presentation Title |
Computational Analysis of Electromigration-Induced Failure in Solder Joints |
| Author(s) |
Choong-un Kim, Harikrishnan Kumarasamy, Patrick Thompson, Sylvester Ankamah-Kusi |
| On-Site Speaker (Planned) |
Choong-un Kim |
| Abstract Scope |
Electromigration-driven failure has become an increasingly critical reliability concern in Cu/Sn solder joints used in electronic packaging. Under prolonged current stress, atomic flux and dynamic microstructural evolution lead to the accelerated growth of intermetallic compounds (IMCs) and the formation of Kirkendall voids—key indicators of degradation. Modeling these complex mechanisms is challenging, largely because solder joints behave as open systems where atomic migration interacts directly with evolving microstructures. To bridge this gap, we developed a phase-field-based finite element analysis (FEA) framework that simulates the coupled kinetics of IMC growth and void formation under electromigration. The model incorporates current crowding and grain size effects to enhance realism and predictive accuracy. Simulation results closely align with experimental observations, offering a robust tool to investigate long-term reliability. This study presents the methodology and highlights insights into the failure evolution, laying groundwork for improved predictive modeling of solder joint behavior in next-generation electronics. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Computational Materials Science & Engineering, Electronic Materials, Joining |