| About this Abstract |
| Meeting |
Materials Science & Technology 2019
|
| Symposium
|
Joining of Advanced and Specialty Materials XXI
|
| Presentation Title |
Study of Solid-State Reactions in Diffusion Bonded Inconel 600 to SiC with Metallic Interlayers |
| Author(s) |
Yaiza Rodriguez, Timothy Phero, Allyssa Bateman, Kyu Han, Jim Steppan, Balky Nair, Brian Jaques |
| On-Site Speaker (Planned) |
Yaiza Rodriguez |
| Abstract Scope |
Bonded silicon carbide (SiC) and Inconel 600 transitions are promising structures for high temperature and high pressure heat exchanger applications. The solid-state diffusion reactions at the interfaces between SiC and Inconel 600 were studied with an Ag or Ag-Pd interlayer to optimize the bonded joints. The effects of bonding temperature, time, and pressure on diffusion behavior were investigated through scanning electron microscopy coupled with energy dispersive X-ray spectroscopy. Characterization and tensile testing of the joints showed that the process parameters were not linearly interconnected to predict diffusion/transition behavior, and that bond strength was influenced by the quantity of new interfacial phases present. Precise control of diffusion reactions through bonding parameters dictates the feasibility and performance of the diffusion bonded SiC-Inconel 600 transitions. |