About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
The impact of surface diffusion on microstructural evolution in Cu/Sn solder joint |
| Author(s) |
Choong-un Kim, Harikrishnan Kumarasamy, Sylvester Ankamah-Kusi, Tae-Kyu Lee |
| On-Site Speaker (Planned) |
Choong-un Kim |
| Abstract Scope |
This paper presents both experimental and computational analyses of microstructural evolution in Cu/Sn solder joints influenced by surface interdiffusion along Cu. While extensive studies have examined IMC growth and void formation in Sn-based solder joints, the role of surface diffusion has often been overlooked, which is likely due to the prevailing assumption that the low homologous temperature of Sn limits interdiffusion to bulk diffusion pathways. However, our recent findings demonstrate that surface diffusion along Cu is both active and consequential, significantly accelerating the kinetics and altering the mechanisms of IMC growth and void formation. Experimental observations from specially designed solder joint configurations clearly reveal enhanced IMC formation and voiding attributable to surface diffusion. These findings are further validated through computational analyses of interdiffusion behavior and phase evolution. This paper highlights these key discoveries and presents supporting evidence that underscores the critical influence of surface diffusion in solder joint reliability |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Joining, Modeling and Simulation |