About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale VIII
|
| Presentation Title |
Thermal stability of Cu-Mo nanometric metallic multilayers: a molecular dynamics study |
| Author(s) |
Abdelhafid Akarou, Florence Baras, Olivier Politano |
| On-Site Speaker (Planned) |
Abdelhafid Akarou |
| Abstract Scope |
Nanometric Metallic Multilayers (NMMs) composed of immiscible metals are promising composite materials for advanced applications. Notably, they exhibit a combination of high thermal conductivity and low thermal expansion, making them suitable candidates for thermal management systems. However, a key challenge lies in their thermal stability at elevated temperatures.
In this study, NMMs consisting of Cu and Mo layers were investigated using molecular dynamics simulations (MD). The stability of the incoherent Cu/Mo interface was assessed by analyzing the system’s preferred orientation relationships.
At high temperatures, these multilayers undergo degradation due to interfacial stresses and grain boundary diffusion, which significantly impacts their thermal performance. The evolution of thermal conductivity was quantified using two-temperature model molecular dynamics (TTM-MD) at various stages of microstructural degradation—from well-ordered multilayers to a nanocomposite-like structure.
Acknowledgments:
This work is supported by ANR (grant ANR-23-CE09-0002-01). |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Thin Films and Interfaces, Composites |