About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Chemistry and Physics of Interfaces
|
| Presentation Title |
Localized Grain Boundary Engineering in Fine-Grained Copper by Thermal-Elastic Processing |
| Author(s) |
Marivel Alfaro, Adrian Contreras, Carson Sutton, James Burns, Diego Cea, Isaiah Clemons, Wenwu Xu |
| On-Site Speaker (Planned) |
Marivel Alfaro |
| Abstract Scope |
Thermal-elastic processing (TEP) offers a route to modify grain boundaries without the bulk deformation and recrystallization required in conventional grain boundary engineering. This talk integrates new fine-grained pure copper experiments with atomistic molecular dynamics (MD) simulations to establish TEP as a method for localized grain boundary modification. Copper specimens were processed at 200°C under 200 MPa with holding times of 0, 5, 10, and 20 min. Statistical microscopy analysis quantifies hold time-dependent changes in grain boundary morphology while assessing whether the fine-grained matrix remains largely preserved. Complementary MD simulations isolate how coupled elastic stress and thermal activation concentrate deformation and structural rearrangement near copper grain boundaries through local sliding, defect emission, and boundary diffusion. Together, the experimental trends and atomic scale mechanisms show how TEP can tune grain boundary morphology in pure copper while minimizing bulk microstructural change. |
| Proceedings Inclusion? |
Planned: |