About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
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Symposium
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Bridging Scale Gaps in Multiscale Materials Modeling in the Age of Artificial Intelligence
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Presentation Title |
Realizing high-throughput multi-scale simulations of materials through machine learning |
Author(s) |
Shyue Ping Ong |
On-Site Speaker (Planned) |
Shyue Ping Ong |
Abstract Scope |
A fundamental challenge in computational materials science is bridging length and time scales from quantum to atomistic to continuum. In this talk, I will present a roadmap to attacking this challenge in an automated fashion through machine learning (ML). In the past decade, ML interatomic potentials (MLPs) have emerged as a robust approach to bridge the quantum and atomistic scales by learning the potential energy surface from high-throughput ab initio calculations. In turn, simulations from MLPs can be used to learn statistical parameters for continuum scale models. I will illustrate this process using several prototypical examples from multi-principal element alloys and solid ceramic electrolytes for lithium-ion batteries. Finally, I will outline the major gaps that remain to the realization of high-throughput multi-scale simulations of materials. |
Proceedings Inclusion? |
Planned: |
Keywords |
Computational Materials Science & Engineering, Machine Learning, Mechanical Properties |