About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Defect detection and analysis of Through Silicon Vias (TSVs) in Electronic Packages by
X-ray Laminography and 3D X-ray Tomography
|
| Author(s) |
Sidhaant Vasudeva, Viktor Nikitin, Alan Kastengren, Francesco De Carlo, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Sidhaant Vasudeva |
| Abstract Scope |
Through Silicon Vias (TSVs) are a critical part of 3D heterogeneous integrated packaging, which is the next step in electronic packaging due to higher energy efficiency and system integration. TSVs are sites of major defects which can compromise the whole package. Cracking, surface delamination, voids, protrusions and thermal stresses are formed in TSVs during fabrication or operation. In this study we have employed advanced x-ray imaging techniques, like x-ray laminography and high-resolution 3D x-ray tomography, to visualize and analyze these defects in both industrial packages and lab-fabricated TSV structures. By correlating defect types with specific fabrication parameters, we aim to offer insights into optimizing TSV reliability through process control. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, |