About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Development of Sn–In–Ag Composite Solder using Transient Liquid Phase Bonding |
| Author(s) |
Chang-Yu Lu, C. Robert Kao |
| On-Site Speaker (Planned) |
Chang-Yu Lu |
| Abstract Scope |
With the rapid development of high-density electronic packaging, low-temperature bonding materials have attracted significant attention due to their excellent ability to reduce thermal stress. In this study, a Sn–In-Ag composite solder paste was developed, and its microstructural evolution and bonding characteristics were investigated using Transient Liquid Phase (TLP) bonding. Different solder compositions were first designed based on the Sn–In–Ag ternary phase diagram to identify compositions with possible formation of intermetallic compound (IMC). Vacuum reflow processing was performed to fabricate the solder joints, followed by analyses of the resulting microstructure, IMC formation, and shear strength. The microstructural evolution of the joints was examined under different processing conditions to evaluate their effects on bonding quality. These findings demonstrate that the proposed Sn–In–Ag composite solder paste is a promising candidate for achieving low-temperature bonding with high reliability through the TLP bonding process, providing potential applications in electronic packaging. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Joining, Mechanical Properties, Phase Transformations |