Conference Logo ProgramMaster Logo
Conference Tools for 2027 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools

About this Abstract

Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
Presentation Title Phase diagrams and interfacial reactions of Co-Ni-Ge ternary system
Author(s) Man-Hua Lee, Yung-Chun Tsai, Cheng-Hsi Ho, Sinn-wen Chen
On-Site Speaker (Planned) Yung-Chun Tsai
Abstract Scope The Co-Ni-Ge ternary system is an important material system with promising thermoelectric and electronic applications. This study determines the phase equilibria isothermal sections at 800 °C and 600 °C to provide fundamental materials information. Furthermore, the interfacial reactions between CoGe and Ni at 600 °C and 500 °C were investigated. Two continuous solid-solution phases, (Co,Ni)₅Ge₃ and (α-Co,Ni), exist at both 800 °C and 600 °C. The Ni3Ge phase exhibits significant Co solubility. CoGe and NiGe also exhibit significant mutual solubilities, but they do not form a continuous solid solution. The reaction path of the Ni/CoGe diffusion couples reacted at both 600 °C and 500 °C is Ni/Ni₃Ge/ (Co,Ni)₅Ge₃/ CoGe, and the dominating diffusion species is Ge. The reaction rates decrease significantly with decreasing temperature. The thickness of the reaction layer is only 1 μm after reaction at 300 °C for 50 days.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Copper / Nickel / Cobalt, Other

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A strain-driven compositional detour in an in situ TCP precipitation
Autonomous assessment of phase formation using the AlloyBot self-driving laboratory
Bonding ability of direct Ag nanostructures formed by metal-organic decomposition
Concentrated Sliding Friction Strengthened Dissimilar Stainless Steel/Ti Interface via Phase Transformation During Ultrasonic Spot Welding
Design and development of the multi-functional Ni-Mn-Ga composites for energy conversion
Diffusion Investigation in Cu-Co System
Effect of Annealing on Microstructure in a Zr-Based Thin-Film Metallic Glass Diffusion Barrier and Interfacial Reactions during Cu/Sn/Cu Thermocompression Bonding
Effects of Bi Additions on the Characteristics of Sn-In Solder
Electrostatic Assembly of Silver Micro/Nano Hybrids for Low Temperature Die Attach Sintering below 200 °C
Enhanced Corrosion Resistance and Reliability of Coated Copper Wire Bonding in Automotive Electronics via Interface Engineering
Enhanced Energy Storage Performance via Machine Learning Defined Phase Formation-Property Relationships in Multi-component Alloys
How to design high-strength Sn-In solders using CALPHAD and machine learning approach
In-Situ Investigation of Tensile Behavior and Creep Response in Sn–Bi-Sb Low-Temperature Solders
Interlayer-driven interfacial phase transformations during ultrasonic welding of titanium
Investigation of Fe/Zn Interfacial Reaction Behavior and Corrosion Properties of Different Steels during Hot-Dip Galvanizing
Investigation of interfacial Reactions between Sn-xZn Solder and Cu-4.3 at.%Ti Alloy(C1990HP)
Investigation of Liquid/Solid Interfacial Reactions in the Sn-9Zn/Fe-xNi Couples
Machine Learning-Based Analysis of Residual Stress States in Nanocrystalline Thin Films
Mechanism of Diffusion Barriers Impacting the Failure Mechanism of Sn-Based Solder Joints
Mechanisms of Indium Addition in Modulating Interfacial Reactions and Enhancing the Mechanical Properties of Solder Joints
Microstructure-Dependent Crack Evolution and Creep Response of Sb-added Sn–Bi Low-Temperature Solders
Microstructure-Dependent Current Transport and Joule Heating in Ag Nanowire Networks under Electric Field
Microstructure Evolution of Cu Interconnects under Electromigration: Implications for Hybrid Bonding in Advanced 3D Chip Integration
Nanostructural Characterization for the Interface of Cu Metallized Glass Substrate Prepared via the TORIZING Process
Phase diagrams and interfacial reactions of Co-Ni-Ge ternary system
Phase equilibria of Ni-Ge-Sb and Cu-Ni-Ge ternary systems
Solid-State Interfacial Reactions and Intermetallic Compound Growth Kinetics in Sn-Ag Solder/Fe-Ni Under-Bump Metallization Systems
Structural and Phase Stability of Interpenetrating Ag Nano-Islands in Nafion Soft Actuators
The Influence of Undercooling on β-Sn Nucleation and Crystallographic Selection in Near-Eutectic Sn–58Bi Solder
Thermal Shock Reliability Evaluation of Ag-Al Paste Joints in SiC Power Modules

Questions about ProgramMaster? Contact programming@programmaster.org | TMS Privacy Policy | Accessibility Statement