About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Crystallinity-Gradient Co–P Metallization for Rapid Co–Sn Full-IMC Interconnects |
| Author(s) |
Shuang Liu, Fu Guo |
| On-Site Speaker (Planned) |
Shuang Liu |
| Abstract Scope |
Co-Sn full-intermetallic compound (full-IMC) joints are promising for power-device packaging because they can be formed at low temperature and remain stable during high-temperature service. However, rapid IMC growth may cause coarse microstructures and brittle failure. In this work, a crystallinity-gradient Co-P coating was designed to regulate Co-Sn IMC formation during transient liquid phase bonding. The coating showed a continuous transition from an amorphous region near the substrate to a nanocrystalline region near the solder. The amorphous Co-P region promoted Co/Sn interdiffusion and accelerated IMC growth, while the nanocrystalline Co-P region supplied abundant heterogeneous nucleation sites and helped block Sn attack into the coating. This gradient design promoted uniform CoSn3 growth, suppressed abnormal coarsening, and shortened the time required for full-IMC formation. This work highlights crystallinity-gradient Co–P metallization as a promising route to rapid, reliable Co-Sn full-IMC interconnects. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Joining, Copper / Nickel / Cobalt, Surface Modification and Coatings |