About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Investigation of Low Temperature Cu/Ag-Ag/Cu Direct Bonding With Highly (111)-Oriented Nanotwinned Structure |
| Author(s) |
Yung-Chieh Chou, Ouyang Fang-Yi |
| On-Site Speaker (Planned) |
Yung-Chieh Chou |
| Abstract Scope |
With the rapid development of 3D integrated circuit (3DIC) packaging, metal-to-metal direct bonding has emerged as a critical solder-free interconnection technology in advanced packaging. Conventional copper-to-copper direct bonding typically requires high bonding temperatures to achieve sufficient bond quality, posing challenges for advanced integration. To reduce the bonding temperature, this study introduces a nanotwinned silver layer deposited on nanotwinned copper bumps as a passivation layer enabling bonding in ambient conditions. Bonding quality is evaluated using FIB analysis, SEM, and shear testing. Compared with conventional Cu–Cu bonding, the proposed Cu/Ag–Ag/Cu structure achieves under the reduced bonding pressure of 20MPa at 220oC in a low vacuum environment. The silver passivation layer effectively suppresses copper oxidation at the bonding interface, thereby enhancing bonding reliability. This approach demonstrates a feasible bonding strategy for future advanced packaging, as silver offers superior electrical properties and strong potential for next-generation semiconductor applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Nanotechnology, Mechanical Properties |