About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Solder in Vibration: Predicting Solder Joint Reliability during High Cycle Fatigue |
| Author(s) |
Hannah Fowler, Lauren Tomanek, Robert Buarque de Macedo, Joshua Minster, Paul Chao, Philip Noell, John Laing, Benjamin White |
| On-Site Speaker (Planned) |
Hannah Fowler |
| Abstract Scope |
Transportation and flight apply tens of thousands of fatigue cycles on solder joints, components, and traces within an electronics assembly through vibration. By applying varying vibration amplitudes to surface mount components, this work examines how high-cycle fatigue impacts solder joint reliability while assessing the role of solder macrovoids and joint geometry. Crack initiation is monitored using time-domain reflectometry, enabling correlation of electrical response with evolving damage. Selected capacitors and their solder joints are serially sectioned using a RoboMET system, allowing for microstructural analysis and fractography of crack propagation through the joint. These experimental observations are integrated into a physics-based finite element model to improve prediction of solder joint lifetimes. By better understanding damage evolution in mechanical fatigue environments, this work aims to account for and predict high-cycle fatigue damage over the lifetime of a solder interconnect.
SNL is managed and operated by NTESS under DOE/NNSA contract DE-NA0003525 SAND2026-23430A |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Joining, Mechanical Properties, Modeling and Simulation |