About this Abstract |
| Meeting |
MS&T25: Materials Science & Technology
|
| Symposium
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Processing and Performance of Materials Using Microwaves, Electric and Magnetic Fields, Ultrasound, Lasers, and Mechanical Work – Rustum Roy Symposium
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| Presentation Title |
Microstructural evolution of copper during ultrasonic surface modification |
| Author(s) |
Teddy Magheto, Carl Boehlert, Upama Biswas Tonny, Sunil Chakrapani |
| On-Site Speaker (Planned) |
Sunil Chakrapani |
| Abstract Scope |
Acoustoplasticity uses high-intensity acoustic/ultrasonic waves to soften and plastically deform structures. This has been successfully used in Ultrasonic Additive Manufacturing and ultrasonic welding of metallic structures. The objective of this article is to understand the microstructural evolution of structure after being subjected to surface ultrasonic loading, specifically in copper. Two different acoustic powers (2.2kW and 2.5kW) were chosen, and a rolling sonotrode was used to directly impart the acoustic vibration/energy onto the plate. Microstructural characterization was carried out by using EBSD/SEM, grain size and hardness measurements. Additionally, a sub-surface texture was also observed which was characterized using pole figure analysis. Further analysis was carried out based on change in geometrically necessary dislocations and the fraction of low angle grain boundaries. The results suggest that a change of 300W in acoustic power plays a significant role in the resulting microstructure. These results could be potentially useful in determining optimal processing parameters. |