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Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Mechanical Behavior at the Nanoscale VIII
Presentation Title Unveiling Negative Creep in High-Entropy Alloys: A Spherical Nanoindentation Study of Time- and Temperature-Dependent Deformation Mechanisms
Author(s) Shreya Mukherjee, Rajiv Mishra
On-Site Speaker (Planned) Shreya Mukherjee
Abstract Scope Understanding creep behavior at high temperatures is crucial for the deployment of high-entropy alloys (HEAs) for structural applications. This study presents the first-ever systematic investigation of time- and temperature-dependent nanoindentation creep in a transformative FeMnCoCrSiCu HEA using a spherical indenter, chosen specifically to provide constant contact geometry that enables extraction of creep parameters, i.e., stress exponent and activation volume. Varying load-controlled indentation creep tests were conducted at 30 °C, 200 °C, and 500 °C, with dwell times of 100 and 500 seconds. A unique feature of the FeMnCoCrSiCu HEA is deformation induced transformation. Pronounced creep was observed even at 200 °C, with stress exponents suggesting dislocation based creep mechanism. At elevated temperatures, a distinct negative creep (plastic strain recovery during dwell) emerged, indicating a transition to different recovery mechanisms. Post-mortem site-specific EBSD and TEM was used to establish the substructural evolution, dislocation annihilation, extent of transformation and grain-level slip transfer.
Proceedings Inclusion? Planned:
Keywords High-Entropy Alloys, Mechanical Properties, Nanotechnology

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