About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Response of Materials Investigated through Novel In-situ Experiments and Modeling
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| Presentation Title |
In-situ Study on Thermal Compression Bonding of Nanotwinned Cu Pillars |
| Author(s) |
Ke Xu, Tongjun Niu, Debargha Paul, Chao Shen, Carol Handwerker, Ganesh Subbarayan, Xinghang Zhang |
| On-Site Speaker (Planned) |
Ke Xu |
| Abstract Scope |
Cu-Cu pillars thermal compression bonding (TCB) technique has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. In-situ micropillar compression is a technique extensively used to investigate the deformation behavior and deformation mechanisms of metallic materials at microscale. Here, we demonstrated the approach of using in-situ micropillar compression technique to investigate TCB of nanotwinned Cu. The in-situ studies enabled the real-time monitoring of the bonding of Cu interfaces under constant stress. Focused ion beam microscopy and transmission electron microscopy revealed the local microstructure and crystallography along the bonded Cu-Cu interfaces. The investigation from in-situ TCB was also combined with the existing bonding models to discuss the influence of diffusion on bonding development. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Electronic Materials, Nanotechnology |