About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Informing Lifetime Predictions of Solder Joints with High Cycle Fatigue Testing |
| Author(s) |
Hannah Fowler, Lauren Tomanek, Robert Buarque de Macedo, John Laing, Philip Noell, Joshua Minster, David Kemmenoe, Benjamin White |
| On-Site Speaker (Planned) |
Hannah Fowler |
| Abstract Scope |
Solder joints are integral to high reliability applications, and, while thermal cycling has been widely studied, high cycle fatigue is less understood. Models are often developed for low cycle fatigue applications, but it is unclear if these models still apply in the high cycle regime. Here, high cycle fatigue tests were performed on solder butt joints to develop the high cycle fatigue finite element model, and then this model was applied to real components and solder joint geometries. In this work, we will discuss the vibration testing of surface mount components and the subsequent failure analysis as we compare the predicted component lifetimes to the experimental lifetimes. Solder joints are often a main point of failure within electronic assemblies and improving our understanding of solder alloy performance and behavior is crucial for predicting long-term reliability.
SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525. SAND2025-07776A |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Characterization, Mechanical Properties |