About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Chemistry and Physics of Interfaces
|
| Presentation Title |
Relating Disconnection Dynamics to Interface Dynamics |
| Author(s) |
Inam Iqbal Lalani, Ryan B Sills |
| On-Site Speaker (Planned) |
Inam Iqbal Lalani |
| Abstract Scope |
It is widely accepted that crystalline interface migration is largely the result of disconnection migration. However, a quantitative connection between disconnection dynamics and overall interfacial migration is lacking. In this work, we employ the Interfacial Line Defect Analysis (ILDA) technique developed by the authors to reveal disconnection-mediated mechanisms of grain boundary migration in MD simulations. Through our analyses, we observe several previously unappreciated phenomena. First, instead of nucleating and smoothly expanding, the disconnection loops “flicker” in and out of existence before reaching a stable size. Second, a strong correlation between vacancy production and boundary migration indicates that disconnection climb occurs during migration. Third, we observe “disconnection walls” in the interface, manifesting as large, stable steps of stacked disconnections that arrest migration. Finally, we identify disconnection modes that drive rapid grain boundary motion. These findings lay a foundational understanding of interfacial mobility in the absence of bulk line defects. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Computational Materials Science & Engineering, Mechanical Properties |