About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing of Advanced Functional Materials and Devices—From Processing Concepts to Applications
|
| Presentation Title |
Additive Manufacturing of Interconnect Structures for Microelectronics Packaging Applications |
| Author(s) |
Michael Cullinan |
| On-Site Speaker (Planned) |
Michael Cullinan |
| Abstract Scope |
Microscale selective laser sintering (μ-SLS) is an additive manufacturing process for the fabrication of 3D electronic interconnect structures with micron scale resolutions. In this process, a thin layer of nanoparticle ink is first spread onto the substrate. The substrate is then positioned under an optical subsystem using a custom built nanopositioning device. A laser that has been focused off a micromirror array is then used to sinter the nanoparticles together in a desired pattern with micrometer resolution. Another layer is then coated onto the substrate and the process is repeated to build up the 3D structure. Finally, the unsintered nanoparticles are washed away to reveal the final 3D part. This talk will present the materials science, mechatronic systems, optics designs, and process modeling used to make this additive manufacturing process capable of achieving micrometer resolution with high throughput (~63 mm^3/h) over large areas (~ 50 mm x 50 mm). |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Nanotechnology, Process Technology |