About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Computational Thermodynamics and Kinetics
|
| Presentation Title |
H-23: Molecular Dynamics Analysis of Asperity Part Removal of Metal Film by Plasma |
| Author(s) |
Yoshishige Okuno, Tomoyuki Tsuyama, Tatsuki Oyama, Yu Azuma, Haruhisa Ohashi, Masahiro Irie, Ayumi Yamakawa, Shoko Uetake, Takayuki Konno, Takahiro Ukai, Kohei Ochiai, Nobuyuki Iwaoka, Atsushi Hashimoto |
| On-Site Speaker (Planned) |
Yoshishige Okuno |
| Abstract Scope |
We investigated the reduction of nanometer-scale surface asperities on metallic thin films through plasma modification processes, integrating molecular dynamics simulations with atomic force microscopy analysis. Our molecular simulations simulated ion bombardment using inert gas ions (Ne, Ar, Kr, and Xe) on cobalt slabs featuring nanoscale protrusions. The results highlight that heavier inert gases exhibit greater efficiency in reducing asperity size, even with lower etching rates. Specifically, as the atomic number of the inert gas increases, the size of the surface asperities decreases more effectively due to enhanced momentum transfer during collisions. The atomic force microscopy measurements showed that the density of protrusions diminishes as the gas's atomic number increases used for the surface modification process. X-ray fluorescence analysis confirmed that a higher atomic number of gases led to lower etching rates, providing a dual advantage of effective asperity reduction while preserving material thickness. These observations agree with the simulation results. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Computational Materials Science & Engineering, Electronic Materials, Magnetic Materials |