About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections
|
| Presentation Title |
Development of Silver─Tin Alloy Paste for High Power IC Packaging by High Energy Ball Milling |
| Author(s) |
Wei-Chen Huang, Chin-Hao Tsai, C. Robert Kao |
| On-Site Speaker (Planned) |
Wei-Chen Huang |
| Abstract Scope |
Ag–Sn alloy paste for die attachment of high power devices packaging is developed. The alloyed powders are prepared by high-energy ball milling of Ag and Sn powders in an argon atmosphere. The mechanical alloying process is performed in a planetary ball mill with a series of milling speeds for 2, 6, and 10h to determine the optimal milling parameters. Characterization of the powders is carried out by XRD and SEM. The die bonding is carried out between metalized Cu substrates and the sintering process is analyzed by cross-sectional observation. Structural integrity of the Ag–Sn paste is investigated by a high-temperature storage test. The joint is comprised of Ag(Sn) solid solution, and Cu(Sn) solid solution formed at the interface between joint and Cu substrate. The die shear strength is approximately 40 MPa obtained at 10 wt.% Sn alloyed powders, and maintain its strength after 2000h of aging at 300⁰C. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Temperature Materials, Joining, Powder Materials |