About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Presentation Title |
Finding the Adhesion Sweet Spot: How to Make Your Print Stick to, But Not Get Stuck on, the Build Plate |
Author(s) |
Eric S. Elton, Jeff Fingerle, Nicholas Watkins, Justin Cabral, Viktor Sukhotskiy, Andrew Pascall, Jason Jeffries |
On-Site Speaker (Planned) |
Eric S. Elton |
Abstract Scope |
Adhesion of the liquid metal droplets to the build plate during LMJ printing is crucial for successful printing. Equally important is being able to easily remove your part from the build plate after printing. Here we discuss methods to quantify how well a sample part adheres to the build plate and discuss how this relates to part adhesion during printing and removal. We also explore other parameters which impact droplet adhesion and part quality, including intermetallic formation, heat transfer through the build plate, and elevated build plate temperatures. We explore these parameters by printing tin parts on various substrates.
Prepared by LLNL under Contract DE-AC52-07NA27344.LLNL-ABS-0-rev-1 |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |