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Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
Presentation Title Machine Learning-Based Analysis of Residual Stress States in Nanocrystalline Thin Films
Author(s) Roland Brunner, Rahulkumar Jagdishbhai Sinojiya, Charlotte Cui
On-Site Speaker (Planned) Roland Brunner
Abstract Scope Metallic thin-films are essential for a wide range of applications, ranging from energy storage to high-power semiconductors. Here, the consideration of the correlation between microstructure, processing and the thin film property is of utmost importance. Thin films show highly attractive material properties, such as high hardness, strength and wear resistance. However, a big drawback concerns the emerging large residual stresses that result from their fabrication by deposition. The engineering of the microstructure allows to control the residual stress states, which in turn affect their performance and properties. In this paper, we discuss the impact of minority element concentration on residual stresses that emerge after deposition in tungsten-titanium films with different titanium concentrations as well as study the influence of tramp elements on the microstructural equilibration in electroplated Cu-thin-films. We illustrate how our developed analysis workflow incorporating local residual stress measurements, structural as well as chemical characterization, physical modeling and machine learning for data extraction and stress prediction fosters the engineering of improved thin-films.
Proceedings Inclusion? Planned:
Keywords Characterization, Thin Films and Interfaces, Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A strain-driven compositional detour in an in situ TCP precipitation
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Bonding ability of direct Ag nanostructures formed by metal-organic decomposition
Concentrated Sliding Friction Strengthened Dissimilar Stainless Steel/Ti Interface via Phase Transformation During Ultrasonic Spot Welding
Design and development of the multi-functional Ni-Mn-Ga composites for energy conversion
Diffusion Investigation in Cu-Co System
Effect of Annealing on Microstructure in a Zr-Based Thin-Film Metallic Glass Diffusion Barrier and Interfacial Reactions during Cu/Sn/Cu Thermocompression Bonding
Effects of Bi Additions on the Characteristics of Sn-In Solder
Electrostatic Assembly of Silver Micro/Nano Hybrids for Low Temperature Die Attach Sintering below 200 °C
Enhanced Corrosion Resistance and Reliability of Coated Copper Wire Bonding in Automotive Electronics via Interface Engineering
Enhanced Energy Storage Performance via Machine Learning Defined Phase Formation-Property Relationships in Multi-component Alloys
How to design high-strength Sn-In solders using CALPHAD and machine learning approach
In-Situ Investigation of Tensile Behavior and Creep Response in Sn–Bi-Sb Low-Temperature Solders
Interlayer-driven interfacial phase transformations during ultrasonic welding of titanium
Investigation of Fe/Zn Interfacial Reaction Behavior and Corrosion Properties of Different Steels during Hot-Dip Galvanizing
Investigation of interfacial Reactions between Sn-xZn Solder and Cu-4.3 at.%Ti Alloy(C1990HP)
Investigation of Liquid/Solid Interfacial Reactions in the Sn-9Zn/Fe-xNi Couples
Machine Learning-Based Analysis of Residual Stress States in Nanocrystalline Thin Films
Mechanism of Diffusion Barriers Impacting the Failure Mechanism of Sn-Based Solder Joints
Mechanisms of Indium Addition in Modulating Interfacial Reactions and Enhancing the Mechanical Properties of Solder Joints
Microstructure-Dependent Crack Evolution and Creep Response of Sb-added Sn–Bi Low-Temperature Solders
Microstructure-Dependent Current Transport and Joule Heating in Ag Nanowire Networks under Electric Field
Microstructure Evolution of Cu Interconnects under Electromigration: Implications for Hybrid Bonding in Advanced 3D Chip Integration
Nanostructural Characterization for the Interface of Cu Metallized Glass Substrate Prepared via the TORIZING Process
Phase diagrams and interfacial reactions of Co-Ni-Ge ternary system
Phase equilibria of Ni-Ge-Sb and Cu-Ni-Ge ternary systems
Solid-State Interfacial Reactions and Intermetallic Compound Growth Kinetics in Sn-Ag Solder/Fe-Ni Under-Bump Metallization Systems
Structural and Phase Stability of Interpenetrating Ag Nano-Islands in Nafion Soft Actuators
The Influence of Undercooling on β-Sn Nucleation and Crystallographic Selection in Near-Eutectic Sn–58Bi Solder
Thermal Shock Reliability Evaluation of Ag-Al Paste Joints in SiC Power Modules

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