About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale VIII
|
| Presentation Title |
Influence of indenter shape on the deformation and delamination of thin films |
| Author(s) |
Jeffrey M. Wheeler |
| On-Site Speaker (Planned) |
Jeffrey M. Wheeler |
| Abstract Scope |
The integrity and adhesion of thin films is critical to the manufacture of many semiconductor components. Inspired by the seminal work of Gerberich et al. [1] on the development of nanoindentation methods for the determination of critical failure loads of thin films, in this work, we explore the influence of indenter shape on the deformation and delamination of a wide range of industrial thin films under indentation and scratch loading. Continuous stiffness measurement is utilized during both loading and unloading of the indentation to provide additional information on the detection of delamination during indentation the quantification of delamination energy.
[1] Volinsky, Alex A., Joseph B. Vella, and William W. Gerberich, Thin solid films 429.1-2 (2003): 201-210. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, Thin Films and Interfaces |