About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XII
|
| Presentation Title |
A-15: Development of Thermoelectric Diffusion Barrier via Phase Diagram Engineering |
| Author(s) |
Wen-Ching Wu, Hsin-jay Wu |
| On-Site Speaker (Planned) |
Wen-Ching Wu |
| Abstract Scope |
Nowadays, people look forward to producing thermoelectric devices with low-cost and high stability, so metal thermoelectric (TE) devices have been gradually accepted. Meanwhile, we choose β-FeSi2 or CoSb3, a metal electrode, and the mid-entropy diffusion barrier, and combine these materials to produce a thermoelectric module.
In this research, we choose a mid-entropy Ti-Al-Cr-Ni system to construct a quaternary phase diagram. By producing this phase diagram we can obtain a single phase region, which may be a prospective composition for producing a diffusion barrier by sputtering on a metal TE device. Moreover, the interfacial diffusion between layers will also be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Energy Conversion and Storage, High-Entropy Alloys, Thin Films and Interfaces |