About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Strain-rate sensitivity on solders via nanoindentation |
| Author(s) |
Jia-Huei Tien, Lijia Xie, John Edward Blendell, Carol A Handwerker, David F Bahr |
| On-Site Speaker (Planned) |
Jia-Huei Tien |
| Abstract Scope |
Nanoindentation was used to characterize the strain-rate sensitivity, pop-in behavior, and the constitutive mechanical response of pure Sn and SAC305 solders with Bi additions. A range of constant strain-rate loadings was performed to determine the strain-rate sensitivity, providing insight into the viscoplastic response. Adding Bi to SAC305 lowered the shear stress required for yielding by about 50%, suggesting Bi facilitates dislocation nucleation at lower stresses, though subsequent solid solution strengthening increases the overall hardness with Bi additions. The strain-rate sensitivity of pure Sn and SAC305 are 0.06 and 0.16, while SAC305 with Bi was strongly influenced by precipitate distribution and suggests strain rate sensitivity is influenced by both the creation and motion of dislocations . Finite element analysis was used to describe a constitutive model of the solder. The integration of experimental nanoindentation data with numerical simulations provides a comprehensive approach for evaluating the mechanical behavior of solders. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Other |