About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections
|
| Presentation Title |
Low Temperature Direct Bonding in Atmosphere on Highly (111) Oriented Nanotwinned Silver |
| Author(s) |
Ching-Yao Cheng, Po-Hsien Wu, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Ching-Yao Cheng |
| Abstract Scope |
In the development of 3D IC technology, metal-to-metal direct bonding has been regarded as an important technique to to enable heterogeneous integration. In this study, we proposed to adopt highly (111) oriented nanotwinned Ag films as bonding materials due to their good electrical and mechanical properties. The resistivity and hardness of Ag films is around 2.03 μΩ-cm and 1.9 GPa, respectively. The Ag-to-Ag direct bonding using highly (111) oriented nanotwinned Ag films and bumps can be achieved by thermo compression process at 200 ℃ under air atmosphere within a short time. The bonding ratio could be higher than 90 %, and the bonding strength could reach 70.0 MPa in the shear test. Furthermore, the Ag films and bumps remained nanotwinned structure after bonding. Meanwhile, the Ag-to-Ag bonding samples could provide good specific contact resistance. The corresponding bonding mechanism would be discussed in more details in this work. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Joining, Electronic Materials |