About this Abstract |
| Meeting |
MS&T25: Materials Science & Technology
|
| Symposium
|
Processing and Performance of Materials Using Microwaves, Electric and Magnetic Fields, Ultrasound, Lasers, and Mechanical Work – Rustum Roy Symposium
|
| Presentation Title |
Precision laser joining of copper busbars with minimal thermal damage for power semiconductor modules |
| Author(s) |
Yeji Yoo, Eunjoon Chun, Semin Park, Keunjae Lee |
| On-Site Speaker (Planned) |
Yeji Yoo |
| Abstract Scope |
With the increasing demand for ultra-compact and high-efficiency electronics, such as power semiconductor modules and EV battery assemblies, precise and reliable Cu busbar joining has become essential. This study proposes a precision laser joining strategy utilizing a single-mode fiber laser (wavelength: 1068 nm; beam diameter: 38 µm) under ultra-low heat input conditions (below 5 J/mm). By applying ultra-fast, low-input laser scanning, we evaluated the potential to minimize thermal damage around the joint. Various scan patterns and joining areas were considered, and their effects on the mechanical, electrical, and microstructural properties of the joints were systematically analyzed. Furthermore, numerical and thermodynamic simulations were employed to theoretically examine how laser processing parameters influence joint behavior. This comprehensive study provides insights into optimizing Cu busbar joining for next-generation power electronics. |