About this Abstract |
| Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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| Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
| Presentation Title |
Enabling Direct Conformal Printing of Conductive Traces by Tailoring Oxidized Eutectic Fields Metal |
| Author(s) |
Manas Vyas, Supreet Thale, Ravi Tutika, Michael Bartlett, Christopher Williams |
| On-Site Speaker (Planned) |
Manas Vyas |
| Abstract Scope |
Additively Manufactured Electronics (AME) integrate conductive traces directly into 3D-printed components, enabling multifunctional performance. These conductive pathways are traditionally created using nanoparticle-based silver inks, but present limitations such as lower electrical conductivity compared to bulk metals, brittleness, and high-temperature post-processing (above 150 ºC) that is often incompatible with printed polymer substrates. Recently eutectic low-melting alloys like Field’s metal (FM) have been explored for AME as they offer high conductivity without thermal post-processing. However, prior FM-printing methods require specialized substrates for solidification and tension-driven toolpaths that limit achievable bead sizes and application environment. To address these limitations, the authors investigate pre-processing the FM ink to control the introduction of oxides and thus tailor its solidification kinetics and rheology for direct, pneumatically-driven printing. A variety of structures including free-standing vertical formations, 3D encapsulated circuit, and conformal conductive traces capable of carrying up to 1.94A on a drone polymer chassis are demonstrated. |
| Proceedings Inclusion? |
Planned: Post-meeting proceedings |