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Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Materials Aging and Compatibility: Experimental and Computational Approaches to Enable Lifetime Predictions
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Keywords Other, Characterization, Modeling and Simulation

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Mean-Field Approach for High-Temperature Shape Memory Alloys
Accelerated Aging of Aluminum Alloys for Long-Term Predictions of Corrosion Under Atmospheric Conditions of Temperature and Relative Humidity
Accelerated Oxidation of Epoxy Thermosets With Increased O2 Pressure
Accelerating Computational Calculations of Galvanic Corrosion Using Machine Learning
Characterization of Localized Oxidation in Tantalum and Cracking Susceptibility at High Temperatures Using Auger Electron Spectroscopy
Characterization of Long Term Service Effect on Turbine Blade Alloy
High-Throughput Creep Characterization for Use in Accelerated Aging Prediction
J-44: Accelerated Aging and Lifetime Performance Predictions of Silicone Cushions Under Compression
J-45: Impacts of Aging Additively Manufactured Silicone Polymers in the Presence of Organic Solvents
J-62: Microstructure Influence on the Intergranular Corrosion of Aluminum Alloys by Integrating Experimental Data and Microstructure Incorporated Computational Modeling
Materials Compatibility Testing and Assessment for Materials Reliability
Modeling Corrosion: Efficient Models and Validation for Long Term Degradation
Phase-field-informed Crystal-plasticity Modeling of 3D γ’ Rafting in Ni-based Single-crystal Superalloys
Predicting Compatibility and Aging at the System-Level With a Reaction, Sorption, Transport, and Chemo-Mechanics (ReSorT-M) Model
Predicting Electrochemical Responses Using Machine Learning
Predicting Photo-Oxidative Embrittlement of a Semicrystalline Thermoplastic From Micromechanical Damage
Research on Shape Optimization of Work Roll in Hot Rolling
Strain-Controlled High-Cycle Fatigue of Aged Solder Joints for High-Reliability Environments
Towards High-Throughput Materials Advancement: Thinking About Database Management in Our Studying-Polymers-On-A-Chip (SPOC) Platform
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