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Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Nanocomposite Materials: Innovations in Design, Fabrication, and Applications
Presentation Title Addressing unmet needs with multiscale freeform manufacturing of electronics
Author(s) Yong Lin Kong
On-Site Speaker (Planned) Yong Lin Kong
Abstract Scope The integration of electronics with 3D constructs can enable advanced sensing, actuation, and computational capability. Yet such integration remains challenging due to the inherent geometrical, mechanical, and material dichotomies between conventionally manufactured electronics and three-dimensional systems. My research develops freeform manufacturing strategies for electronics to create devices and architectures with unprecedented functional integration. For example, we developed the ability to selectively anneal nanomaterials on temperature-sensitive constructs by exploiting metamaterial-inspired electromagnetic structures, enabling local programming of the electronic and mechanical properties of spatially freeform microstructures on biomedical devices and biological constructs. We also explored the integration of freeform electronics with digitally designed architectures and metastructures to create next-generation bioelectronics, such as ingestible gastric-resident electronic systems that can realize surgery-free, digitally driven diagnosis and treatment strategies. Ultimately, we strive to create classes of functional devices that address unmet clinical, defense, and societal needs.
Proceedings Inclusion? Planned:
Keywords Additive Manufacturing, Composites, Nanotechnology

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Addressing unmet needs with multiscale freeform manufacturing of electronics
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