About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Mechanism of Diffusion Barriers Impacting the Failure Mechanism of Sn-Based Solder Joints |
| Author(s) |
Choong-Un Kim, Sylvester Ankamah-Kusi, Tae-Kyu Lee, Hyuck Mo Lee |
| On-Site Speaker (Planned) |
Choong-Un Kim |
| Abstract Scope |
This paper presents the role of diffusion barriers, typically Ni-based layers positioned between solder and Cu substrates, in governing the failure mechanisms of Sn-based solder joints subjected to external loading conditions. Advanced electronic packaging increasingly employs diffusion barriers to suppress the growth of brittle Cu-Sn intermetallic compounds and enhance interfacial stability. While these barriers effectively limit interfacial reactions, their influence on long-term degradation processes, particularly electromigration, remains insufficiently understood. This knowledge gap may stem from the limited understanding of the relationships among failure kinetics, barrier microstructural evolution, interfacial phase transformations, and variations in barrier thickness and composition. Our study on the barrier stability during electromigration suggest that diffusion within the interfacial layer, which alters the chemical stability of the barrier phase, has the greatest impact on the failure process. The underlying mechanisms and their implications for reliability will be detailed in this paper. |
| Proceedings Inclusion? |
Planned: |