About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Materials Deposition by Cold Spray and Related Technologies III
|
| Presentation Title |
A Comparison of Plasma Arc Treatment and Furnace Annealing for Restoring Ductility in Cold-Sprayed Copper Deposits |
| Author(s) |
Sarshad Rommel, Anastasios Gavras, Marius Ellingsen, Aaron Nardi, Mark Aindow |
| On-Site Speaker (Planned) |
Sarshad Rommel |
| Abstract Scope |
Copper is one of the metals that has been used most extensively for cold spray deposition due to its excellent combination of electrical and thermal conductivity, good corrosion resistance and high deposition efficiency. One limitation with cold-sprayed copper is the low ductility of as-sprayed material due the high work-hardening coefficient. This effect can be ameliorated using post-deposition heat-treatments, but such treatments may cause complications with the underlying substrate material for cold-sprayed Cu coatings or dimensional repairs. In an attempt to overcome these issues, alternate surface treatments are being explored that can anneal the deposit without compromising the underlying substrate. Here we report a study on the use of plasma arc surface treatment for the annealing of cold-sprayed Cu deposits in much shorter times than conventional furnace annealing. The microstructures of the plasma-treated and furnace annealed deposits are compared, and the differences in the kinetics for the processes are discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Copper / Nickel / Cobalt, Characterization |